Aluminium Alloy Case for Orange Pi Zero 3 Passive Cooling Precise Cutouts Development Board Enclosure Case1APPLICABLE MODELS: Designed specifically for Orange Pi Zero 3, with precise cut outs to correspond to the applicable models, ensuring unobstructed operation. 2PASSIVE COOLING: The Cooling case utilizes passive cooling technology to effectively improve motherboard efficiency and maintain better performance. 3FAST CONDUCTION: Thermal adhesive design ensures fast heat conduction and strengthens the tight connection between the enclosure case and the motherboard. 4STABLE OPERATION: Cooling heatsink can help reduce the motherboard temperature and maintain stable performance operation. 5ALUMINUM ALLOY: Enclosure case is made of aluminum alloy, which is a strong and durable shell that effectively defend the motherboard from external shocks and damages.