Feature: 1. Superfine silver jump wire,phone motherboard soldering precise connection copper wire. 2. Suitable for PCB BGA sodering point, for iPhone fingerprint mainboard chip repair. 3. 0.009mm Diameter and 200m / 656.2ft length, durable and tensile for iphone motherboard fingerprint repair. 4. Non‑insulating type, small and easy to straighten wire, precise connection, avoid short circuit solder joint. 5. No need to remove the lacquer,welding directly. The wire is made of pure copper, and the surface is conductive. Specification: Item Type: Jump Wire Material: Copper Color: Silver Diameter: Approx. 0.009mm Length: Approx. 200m / 656.2ft Used for PCB BGA solder joint, mobile phone fingerprint motherboard chip maintenance. Package List: 1 x Jump Wire