Features:_x000D_ _x000D_ 300 high temperature resistant in the short run, 250 high temperature resistant for a long time. _x000D_ High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. _x000D_ High insulation ensures the safety. _x000D_ Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. _x000D_ 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding. _x000D_ _x000D_ Specification:_x000D_ Product type: Heat Insulation Adhesive Tape_x000D_ Thickness: approx. 0.06mm_x000D_ Length: approx. 33m_x000D_ Stretchability: 35%_x000D_ Peel strength: 5N/25mm_x000D_ Tensile force: 135N/25mm_x000D_ Temperature resistant: Long time: 250; Short time: 300_x000D_ Width: 20mm, 30mm, 50mm for your choice_x000D_ Package size: approx. 9.5 * 9.5 * 2 cm/ 3.74 * 3.74 * 0.79 in_x000D_ Package weight: 47g_x000D_ _x000D_ Package List:_x000D_ 1 * Heat Insulation Adhesive Tape 1300 high temperature resistant in the short run, 250 high temperature resistant for a long time. 2High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. 3High insulation ensures the safety. 4Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 533m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.