CPU GPU Processor IC Cooler 0.671W / m-K Thermal Compound Paste Chipset

2Pcs Heatsink Plaster Thermal Silicone Adhesive Cooling Paste Compound Glue Features: 1. It has good conductivity and wide service temperature range(-60~200), short term 300 high temperature. 2. The surface curing for time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free. 3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries. 4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect. Specifications: Color: White Weight: approx. 10g Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc. Hot melt adhesive type: other Shear strength: 1.5 (MPa) Active use period: 10 (min) Solidification time: 3min 25C Thermal conductivity: >0.671W/for m.k Surface curing time: 10MIN/25 Length :5.5cm(2.17in) Quantity: 2Pcs Operation Manual: 1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again. 2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa. 3. Recommended coating thickness: 0.1-0.5mm, the thinner the better. 4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before painting. Note: Please allow 1-3 for cm differs due to manual measurement. Due to the different display and different light, the picture may not show the actual color of the item. Thanks for your understanding. Package includes: (Without retail package) 2 x Heatsink Plaster Note: Please allow 1-3 mm error/1-27g weight error and actual product color may vary due to lighting conditions