Features: BGA24 chip with a 1.0mm pitch is suitable for two types of pin matrices (6x8MM): 6x4 and 5x5, requiring different boundary boxes. Before taking a photo, please measure the chip size; Use a U-shaped ejector pin for more stable contact (see diagram below); The housing of these is made of special engineering plastic, which has high strength and long service life; The chip is made of imported beryllium copper material, with low impedance and good elasticity; Thickened gold plating layer, thickened electroplating of contacts, low contact impedance, high reliability; Specifications: 1. Material (1) Insulator: PEI and PPS (2) Chip: Be Cu gold plating (30 μm) Transfer nickel plating (50 μm) 2. Electrical Properties (1) Insulation Resistance: 1000mΩ Min, at DC500V (2) Voltage Resistance: 700AC (3) Contact Impedance: Less than 25mΩ (4) PIN Pin Elasticity: 55g/PIN (normal) (5) Mechanical Lifespan: 100,000 times (6) Working Temperature: -65℃ ~ 155℃ Size: Mixed Note: Due to manual measurement, please allow an error of 0-1 cm. Make sure you don't mind before bidding. Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package Includes: 1 PC BGA24 to DIP8 IC Socket