Welcome to the store Professional Design: This CPU bending corrector is specifically designed for Intel 12th and 13th generation CPUs. Premium Build: Crafted from anodized aluminum alloy using CNC precision, ensuring a perfect fit that avoids capacitors for a seamless installation experience. HighPerformance Thermal Paste: Includes custom thermal paste with high thermal conductivity (6.5 W/m K), low thermal resistance, nonmetallic, nonbleeding, and easy to apply. Wide Compatibility: The LGA170 bending correction frame supports Intel 12th and 13th generation CPUs on LGA1700 chipset motherboards, including H610, B660, and Z690 series. Precision Engineering: Approximately 54x70x6mm / 2.13x2.76x0.24in, allaluminum construction, weighing 20g (main body) or 55g (total). Designed to fit the CPU perfectly and support cooler weight, preventing CPU bending. Available in black. Insulated Feet: Features LOTES original specification insulated protective feet for even pressure and crimping. Multiple installations wont damage the CPU cover. Use with a CPU cooler and fan to eliminate hightemperature issues. Easy Installation: Includes an Lshaped screwdriver for easy LGA1700 BCF installation on the CPU. We recommend watching the installation video for a successful, stepbystep setup. Item Type: LGA170 Bending Correction Buckle Material: Aluminum Alloy Size: Approx. 54x70x6mm / 2.13x2.76x0.24in Package Includes: 1 x Bracket 1 x Screwdriver 1 x Thermal Paste 1 x Scraper 1 x Plastic Box Your satisfaction is our top priority. We are committed to providing you with the best service. If you encounter any issues after receiving the product, such as damage or incorrect quantity, please contact us immediately, and we will provide you with the best solution