This listing includes 13 pieces of CDSOT23T03LC in the SOT233 package. Key benefits Compact threeterminal package for spaceconstrained boards, enabling higher component density. Surfacemount design compatible with standard SMT assembly and reflow processes. Lightweight, plastic encapsulation suitable for mass production and routine handling. Consistent, repeatable form factor that fits the widely used SOT233 footprint. Key attributes Model: CDSOT23T03LC Package: SOT233 Pin count: 3 Package style: CDSOT23 family in a threelead SOT233 format Quantity: 13 pieces Functional notes The CDSOT23T03LC designation indicates a device in the SOT233 package. Exact electrical characteristics depend on the specific device type within the CDSOT23T03LC family. For precise specifications, refer to the corresponding datasheet for the exact part variant in this package. Typical applications Small form factor electronics where a threeterminal device is needed on an SMT board, such as transistors, diodes, regulators, or voltage detectors. Prototyping or final product designs where space is at a and a standard SOT233 footprint is preferred. Replacement or upgrade scenarios in compact consumer electronics, hobby projects, and embedded systems requiring a threeterminal SOT233 component. Compatibility and use Designed for standard SOT233 footprints and conventional SMT assembly methods. Suitable for reflow soldering and pickandplace production lines using common SMT equipment. If you need electrical specifications for a particular device within the CDSOT23T03LC family, please consult the specific datasheet for that part variant to ensure compatibility with your design requirements.