SUNSHINE LS4 Multi-Function Heating Platform Glue Removal Layering Machine Chip Desoldering Preheati

•【Multi-Function Heating】 Suitable for tinning, chip glue removal, separation preheating, and mainboard layering operations. •【Intelligent Temperature Control】 Offers precise temperature regulation from ambient to a maximum of 380°C. •【Modular Design】 Features strong compatibility and can be freely switched according to specific needs. •【Large Operating Area】 Supports larger motherboard desoldering operations for convenient and fast work. •【Versatile Application】 Ideal for various tasks including tinning, chip glue removal, separation preheating, and mainboard layering. Specifications: •Temperature Range: Ambient to 380℃ •Functions: Tinning, chip glue removal, separation preheating, mainboard layering •Design: Modular with interchangeable components •Operating Area: Large, suitable for extensive motherboard operations •Temperature Control: Intelligent system Package included: •1 x Heating Machine •1 x Power Cord •1 x English Instruction Manual •1 x Certificate of Conformity