Style: WSON86X5 Key benefits Extremely compact footprint: 6 x 5 mm WSON8 package saves PCB space for dense or portable designs. Improved thermal performance: exposed pad and short conduction paths reduce junctiontoboard thermal resistance compared with leaded packages. Reliable surfacemount assembly: compatible with automated pickandplace and standard reflow soldering processes for yield production. Low parasitics and good electrical performance: short bond lengths and small package volume help minimize inductance and resistance useful for speed or powersensitive circuits. Important attributes Package type: WSON (also called DFNlike WSON8) — 8pin surfacemount package. Size: nominal 6.0 mm x 5.0 mm body dimensions. Mounting: bottomside exposed thermal pad for enhanced heat transfer; standard land pattern recommended for soldering and thermal vias. Compatibility: industrystandard WSON8 footprint; suitable for many ICs that are specified in this package size. Manufacturing: compatible with reflow soldering and typical PCB assembly processes; recommended soldering profile per component datasheet. How it solves problems Saves board area in spaceconstrained products while still providing an exposed pad for heat dissipation. Reduces thermal and electrical losses compared with larger or leaded alternatives, improving reliability and performance. Simplifies automated assembly and consistent solder joints when used with recommended PCB land patterns and solder paste stencils. Typical applications / use scenarios Power management: compact DC‑DC regulator or power controller on smartphone accessories, IoT modules, or small consumer electronics. Precision analog or mixedsignal ICs: amplifier, ADC frontends, or sensor conditioning circuits where low parasitics and thermal control matter. Embedded controllers and sensor hubs: small formfactor wearables, compact industrial sensors, or handheld instruments requiring minimal PCB real estate. Notes for designers Follow the IC manufacturer's recommended land pattern and stencil opening for solder and thermal results. Include thermal vias under the exposed pad if additional heat spreading is required. Verify reflow profile and PCB assembly guidelines per the actual component datasheet that uses the WSON86X5 package.